Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Description
Utilizing the distinctive and inherently dynamic Lattice Boltzmann-based physics, the PowerFLOW CFD solution conducts simulations that effectively replicate real-world scenarios. With the PowerFLOW suite, engineers can assess product performance at the early stages of design, before any prototypes are constructed—this is when alterations can have the most substantial effects on both design and budget. The PowerFLOW system seamlessly imports intricate model geometries and conducts aerodynamic, aeroacoustic, and thermal management simulations with high accuracy and efficiency. By automating domain discretization and turbulence modeling along with wall treatment, it removes the need for manual volume meshing and boundary layer meshing. Users can confidently execute PowerFLOW simulations using a large number of compute cores on widely utilized High Performance Computing (HPC) platforms, enhancing productivity and reliability in the simulation process. This capability not only accelerates product development timelines but also ensures that potential issues are identified and addressed early in the design phase.
API Access
Has API
API Access
Has API
Integrations
Ansys Electronics Desktop (AEDT)
Ansys Fluent
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Vendor Details
Company Name
Dassault Systèmes
Country
United States
Website
www.3ds.com/products-services/simulia/products/powerflow/
Product Features
Simulation
1D Simulation
3D Modeling
3D Simulation
Agent-Based Modeling
Continuous Modeling
Design Analysis
Direct Manipulation
Discrete Event Modeling
Dynamic Modeling
Graphical Modeling
Industry Specific Database
Monte Carlo Simulation
Motion Modeling
Presentation Tools
Stochastic Modeling
Turbulence Modeling