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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.

Description

Utilizing the distinctive and inherently dynamic Lattice Boltzmann-based physics, the PowerFLOW CFD solution conducts simulations that effectively replicate real-world scenarios. With the PowerFLOW suite, engineers can assess product performance at the early stages of design, before any prototypes are constructed—this is when alterations can have the most substantial effects on both design and budget. The PowerFLOW system seamlessly imports intricate model geometries and conducts aerodynamic, aeroacoustic, and thermal management simulations with high accuracy and efficiency. By automating domain discretization and turbulence modeling along with wall treatment, it removes the need for manual volume meshing and boundary layer meshing. Users can confidently execute PowerFLOW simulations using a large number of compute cores on widely utilized High Performance Computing (HPC) platforms, enhancing productivity and reliability in the simulation process. This capability not only accelerates product development timelines but also ensures that potential issues are identified and addressed early in the design phase.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics/ansys-icepak

Vendor Details

Company Name

Dassault Systèmes

Country

United States

Website

www.3ds.com/products-services/simulia/products/powerflow/

Product Features

Product Features

CFD

HPC

Simulation

1D Simulation
3D Modeling
3D Simulation
Agent-Based Modeling
Continuous Modeling
Design Analysis
Direct Manipulation
Discrete Event Modeling
Dynamic Modeling
Graphical Modeling
Industry Specific Database
Monte Carlo Simulation
Motion Modeling
Presentation Tools
Stochastic Modeling
Turbulence Modeling

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