Compare Ansys Sherlock vs. PowerFLOW

Ansys Sherlock stands out as the sole reliability physics-based tool for electronics design that delivers quick and precise life expectancy assessments for electronic components, boards, and systems during the initial design phases. By automating the design analysis process, Ansys Sherlock enables the rapid generation of life predictions, thus eliminating the "test-fail-fix-repeat" cycle that often hampers development. Designers can effectively model the interactions between silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies, allowing for accurate predictions of potential failure risks stemming from thermal, mechanical, and manufacturing stresses, all prior to creating prototypes. Additionally, Sherlock's extensive libraries, which house over 500,000 components, facilitate the seamless transformation of electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each of these models is equipped with precise geometries and material properties, ensuring that stress information is accurately conveyed for reliable predictions. This capability not only enhances design efficiency but also significantly reduces the risk of costly errors in the later stages of product development.

Utilizing the distinctive and inherently dynamic Lattice Boltzmann-based physics, the PowerFLOW CFD solution conducts simulations that effectively replicate real-world scenarios. With the PowerFLOW suite, engineers can assess product performance at the early stages of design, before any prototypes are constructed—this is when alterations can have the most substantial effects on both design and budget. The PowerFLOW system seamlessly imports intricate model geometries and conducts aerodynamic, aeroacoustic, and thermal management simulations with high accuracy and efficiency. By automating domain discretization and turbulence modeling along with wall treatment, it removes the need for manual volume meshing and boundary layer meshing. Users can confidently execute PowerFLOW simulations using a large number of compute cores on widely utilized High Performance Computing (HPC) platforms, enhancing productivity and reliability in the simulation process. This capability not only accelerates product development timelines but also ensures that potential issues are identified and addressed early in the design phase.